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35x35x11mm Pure Copper Heatsink Radiator Heat Sink Cooling for Electronic Chip MOS IC Heat Dissipation

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Enlarge 35x35x11mm Pure Copper Heatsink Radiator Heat Sink Cooling  for Electronic Chip MOS IC Heat Dissipation
35x35x11mm Pure Copper Heatsink Radiator Heat Sink Cooling  for Electronic Chip MOS IC Heat Dissipation enlarge
35x35x11mm Pure Copper Heatsink Radiator Heat Sink Cooling  for Electronic Chip MOS IC Heat Dissipation enlarge
35x35x11mm Pure Copper Heatsink Radiator Heat Sink Cooling  for Electronic Chip MOS IC Heat Dissipation enlarge
35x35x11mm Pure Copper Heatsink Radiator Heat Sink Cooling  for Electronic Chip MOS IC Heat Dissipation enlarge
35x35x11mm Pure Copper Heatsink Radiator Heat Sink Cooling  for Electronic Chip MOS IC Heat Dissipation enlarge
Price from: 59.92 $
Prices are approximate and are indebted to the time of inclusion in the product catalog.

Description:

35x35x11mm Pure Copper Heatsink Radiator Heat Sink Cooling for Electronic Chip MOS IC Heat Dissipation
Introducing the 35x35x11mm Pure Copper Heatsink Radiator Heat Sink Cooling, a highly efficient solution for electronic chip MOS IC heat dissipation. This compact heatsink is specifically designed to effectively dissipate heat generated by electronic components, ensuring optimal performance and longevity. Crafted from pure copper, this heatsink offers excellent thermal conductivity, allowing for rapid heat transfer and dissipation.

Measuring at 35x35x11mm, this heatsink is compact yet powerful, making it suitable for various electronic applications. Its small size enables it to be easily integrated into tight spaces, making it ideal for use in laptops, gaming consoles, routers, and other electronic devices. With its robust construction, this heatsink is built to withstand high temperatures and continuous use, ensuring reliable and efficient heat dissipation.

The pure copper material used in this heatsink not only enhances its thermal conductivity but also provides excellent corrosion resistance, ensuring long-lasting performance. Its finned design maximizes the surface area for efficient heat dissipation, allowing for effective cooling even in demanding environments. With the 35x35x11mm Pure Copper Heatsink Radiator Heat Sink Cooling, you can effectively manage and dissipate heat, preventing overheating and ensuring the smooth operation of your electronic chips and MOS ICs.

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