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XC7K325T-2FFG900C XC7K325T-2FFG900I Package: BGA-900 Programmable Logic Device (CPLD/FPGA) IC Chip

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Enlarge XC7K325T-2FFG900C XC7K325T-2FFG900I Package: BGA-900 Programmable Logic Device (CPLD/FPGA) IC Chip
XC7K325T-2FFG900C XC7K325T-2FFG900I Package: BGA-900 Programmable Logic Device (CPLD/FPGA) IC Chip enlarge
Price from: 60.89 $
Prices are approximate and are indebted to the time of inclusion in the product catalog.

Description:

XC7K325T-2FFG900C XC7K325T-2FFG900I Package: BGA-900 Programmable Logic Device (CPLD/FPGA) IC Chip
The XC7K325T-2FFG900C and XC7K325T-2FFG900I are cutting-edge Programmable Logic Device (PLD) chips designed for high-performance applications. These chips belong to the Xilinx Kintex-7 family and offer exceptional flexibility and versatility. With a BGA-900 package, these chips are suitable for a wide range of applications, including aerospace, telecommunications, automotive, and industrial control systems.

Featuring a Field-Programmable Gate Array (FPGA) architecture, these PLD chips provide designers with the ability to customize and reconfigure the chip's functionality according to their specific requirements. The XC7K325T-2FFG900C and XC7K325T-2FFG900I offer a substantial number of programmable logic cells, high-speed transceivers, and memory blocks, enabling designers to implement complex digital systems with ease.

The BGA-900 package ensures excellent thermal performance and robust mechanical connections, making these PLD chips highly reliable in demanding operating conditions. With their advanced features and extensive programmability, the XC7K325T-2FFG900C and XC7K325T-2FFG900I chips are the ideal choice for engineers and designers seeking a powerful and flexible solution for their CPLD/FPGA requirements.

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